Vias

Single-ended vias

Vias (vertical interconnect access) are an essential part of a multilayered PCB (printed circuit board) design. Vias make an electrical connection between the different layers of a PCB. These are constructed by placing copper pads on each layer of the PCB and drilling a hole through them. The inner part of the via, is filled with a non-conductive material, and the outer layer are coated with a conductive plating used to connect each layer in the PCB.

Objects

viaSingleEnded Create single ended via in PCB stack (Since R2023a)

Functions

`show`	Display PCB component structure or PCB shape (Since R2021b)
`shapes`	Extract all metal layer shapes of PCB component (Since R2021b)

Topics

Eigenmode-Based Solver for PCB Vias
Wave generation and propagation in vias, circuit model, equations.

Featured Examples

Analysis of a Single Ended Via for Proper Placement of Ground Return Vias for 40+ Gbps Signaling

Model the return path of single ended printed circuit board vias using the via analysis feature in RF PCB Toolbox viaSingleEnded.

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Managing Differential Via Crosstalk and Ground Via Placement for 40+ Gbps Signaling

Model the crosstalk of differential signal vias (DSVs) using the via analysis feature in RF PCB Toolbox viaSingleEnded to ensure robust signaling over 40 Gbps. DSVs are subject to crosstalk phenomenon shown in [1] because crosstalk is induced by waves propagating among the Ground Return Vias (GRV) planes and patterns and is less related to the signal return path concerns that affect signal loss and impedance. GRVs do not form a shield around a given site on a PCB at higher frequencies because GRVs do not stop energy propagation; they simply reflect or deflect it. And, based on physical dimensions and materials, this reflected energy may resonate.

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Modeling of via array with open signal vias

Modeling of a via array containing open signal vias [1]. Variation of pitch (distance of the via array grid) and variation in the number of board layers is studied.

Open Live Script